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Electronics and Packaging
1681-1070
2006 Issue 1
xin chun ji yu
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page:插1
xin xi bao dao
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page:43-47,22,30,34,39
ying te er chan pin ( cheng du ) you xian gong si zheng shi yun ying
liu lin fa
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page:42-43
The Application of Modem Chip CMX868
Luo Qi;Zhai Li-jun
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page:40-41,2
Key Technology and Devices of RF MEMS
Xia Mu;Hao Da-bing
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page:35-39
Two Kinds of PCI Core on SOC
Liu Hong;Wu Chun-yu;Guo Tian-lei
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page:31-34
The Method of Hard Disk Encryption Based on Nios Soft Processor
Zhang yu;Li juan;Chen li-xue
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page:28-30
The Library Developing Flow Research of 0.5 μ m CMOS Standard Library
Luo Jing;Tao Jian-zhong
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page:23-27,19
Research in a Test Method of the Electric Power Metering ASIC
Sun Long-bao;Lin Xia
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page:20-22
Packaging Technology for Multi-Stack Die
Yang Jian-sheng
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page:16-19
Multi-Chip Packaging Technologies and its Applications
Long Le
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page:12-15
The Developmental Trends and Prospects for 3D Packaging
Weng Shou-song
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page:8-11
The Latest Status and Trend of Molding Die Cleaning Materials of China Semiconductor Assembly Industry
Huo Ju
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page:3-7
zou yong you zi zhu zhi shi chan quan feng zhuang ji shu de dao lu -- zhuan fang chang dian ke ji dong shi zong jing li yu zuo kang xian sheng
liu lin fa
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page:1-2