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Electronics and Packaging
1681-1070
2006 Issue 1
xin chun ji yu
..............page:插1
xin xi bao dao
..............page:43-47,22,30,34,39
The Application of Modem Chip CMX868
Luo Qi;Zhai Li-jun
..............page:40-41,2
Key Technology and Devices of RF MEMS
Xia Mu;Hao Da-bing
..............page:35-39
Two Kinds of PCI Core on SOC
Liu Hong;Wu Chun-yu;Guo Tian-lei
..............page:31-34
The Method of Hard Disk Encryption Based on Nios Soft Processor
Zhang yu;Li juan;Chen li-xue
..............page:28-30
The Library Developing Flow Research of 0.5 μ m CMOS Standard Library
Luo Jing;Tao Jian-zhong
..............page:23-27,19
Research in a Test Method of the Electric Power Metering ASIC
Sun Long-bao;Lin Xia
..............page:20-22
Packaging Technology for Multi-Stack Die
Yang Jian-sheng
..............page:16-19
The Developmental Trends and Prospects for 3D Packaging
Weng Shou-song
..............page:8-11