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Electronic Engineering & Product World
1005-5517
2016 Issue 5
mcu/soc zhu li ben tu che qi zhui gan shi jie
wang ying ;
..............page:1-3
Beacon challenges the Bluetooth low power (BLE) chips
ying jiu ;
..............page:6-7
Low-cost EMI/EMC pre-compliance testing for IoT electronics design
tai ke ke ji gong si ;
..............page:8-11
Testing solutions for smart cars
xu jiang ;
..............page:15,27
Ideas for development of Chinese IC design houses
qian guo liang ;
..............page:16-17
The study of automatic notes segmentation and recognition based on DPP
zhang shi chao ;, chen zuo ;, lv jie ;
..............page:28-30
A kinect based on point clouds registration algorithm
zhao zuo ;
..............page:31-34
New De-interlacing Algorithm based on three field detection
lin wen fu ;, liu wei jian ;
..............page:37-39,34
The design and implementation of digital multimeter module based on SD8100
xia cui qiang ;, liu na ;
..............page:40-42
Thermal analysis of the thermoelectric cooler based on finite element
hua chu xia ;, qiao xiao hua ;, wang kang jia ;
..............page:43-44,54
Measurement and suppression of power supply ripple
bao xiao lei ;, cai guang yue ;, xu ye zhang ;
..............page:45-47,58
Analysis of solder void ratio affected by oxidation degree of the IGBT module packaging base plate
huang xiao juan ;, wang bao zi ;, ye na ;, xie long fei ;, gao fan ;, liu chao ;
..............page:62-64
DBF algorithm simulation and realization based on FPGA
jia jie min ;, wang sheng tao ;, pei wen long ;
..............page:65-67
chan pin tui jie
..............page:71
de zhou yi qi msp mcu jiang chi xu tuo zhan
wang ying ;
..............page:76
te jie xi shi he type c usb de 5a bao xing lian jie qi
wang ying ;, jin wang ;
..............page:77