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Electronic Product Reliability and Environmental Testing
1672-5468
2009 Issue 3
Analysis of Software Failure Cause
XIE Bui-sheng
..............
page:13-19
Reliability Evaluation Model of Component-based Software
DENG Yong-jin;WANG Hai-jun
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page:9-12
The Evaluation and Measure of Software Quality Based on Testing Data
GUO Wei-quan
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page:5-8
Study on Software Quality Evaluation Method Based on Hierarchy-Grey Analytic Method
HAN Xin-yu;TANG Long-li;LIU Bai
..............
page:1-4
Monitoring Technology for Wire Bonding in Automatic Gold Wire Ball Bonder
LI Zi-qiang
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page:34-37
Accelerated Life Test Design for the Reliability Assessment of LEDs
SUN Xiao-jan;XIE Jing-song
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page:20-25
Qscillation Prevention of DF-100A SW PSM Transmitter
WANG Ceng
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page:26-30
Uncertainty Evaluation for Temperature Rise Test of Electronics with Thermal Couple
ZHONG Ji
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page:31-33
Study on Reliability of Traffic Network Based on Connection Matrix
SUN Yong-fu;LI Xiao-guang;FANG Ming-jun
..............
page:55-57
Study on Preventive Maintenance
JIA Fa-fen
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page:50-54
Consideration of the Envionmental Test in Product Devolopment and Production
WANG Kui-zhan;SHEN Xin;CHENG De-bin
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page:46-49
A New Estimation Model of Sudden Failure Rate of Electronic Components
XIA Gui-bin;HUANG Zheng;CHENG Li-qiang;CHENG Guo-wei
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page:42-45
Reliability Analysis of Electronic Equipment Based on Accelerated Degradation
YUAN Li-feng
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page:38-41
tou gao xu zhi
..............
page:插页2
zheng gao qi shi
..............
page:插页1
2008 nian 10 yue 2009 nian 3 yue ban bu de bu fen dian qi yu dian zi lei iec biao zhun
liu zhi ya
..............
page:61-65
xin xi yu dong tai
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page:4,19,33,49
The Principle of the Double Sampling and its Simulation
WEI Xuan-ping;YAO Min-li;ZHANG Zhou-sheng
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page:58-60