Electronic Product Reliability and Environmental Testing 2007 Issue 3 ben qi dao du

Home | Survey | Payment| Talks & Presentations | Job Opportunities

Journals A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

Electronic Product Reliability and Environmental Testing
1672-5468
2007 Issue 3

ben qi dao du

..............page:插1

tou gao xu zhi

..............page:73

zheng gao qi shi

..............page:72

ke kao xing yu huan jing shi ying xing biao zhun xin xi yu xing ye dong tai

..............page:14,24,30,33,41,45,59,67

Simulating Pyroshock Environment of Missiles and Launch Vehicles with Testing Equiprent
ZHANG Hua;WU Bin;YE Ten-bo

..............page:68-71

Calculation of Alternating Current Impedance of ED-Vibrator Amature
JIANG Yun-tai;WANG Li-juan

..............page:63-67

Embedded System Design Using WindowsCE
LI Yong-bo;CHEN Wan-hua;ZHANG Shao-bin

..............page:60-62

Realization of FPGA for Radar Azimuth Former
CHEN Wan-hua;LI Yong-bo

..............page:57-59

Systematic Management of Testing and Calibration Laboratory
LIU Chun-hao;WANG Tao

..............page:52-56

Discussion on MIL-HDBK-217F
ZHOU Lei

..............page:50-51

Accelerated Reliability Testing and its Application
LU Ming-chun;LIANG Hong-wei;ZHANG Chun-hua;CHEN Xun

..............page:46-49

Common Issues and Solution in the Implementation of ISO 14001
FENG Yuan

..............page:42-45

Discussion on How to Improve Quality Management of Products
GAO Ming-li

..............page:38-41

Discussion of Device Modeling in the Tolerance Analysis
ZHANG Shang-zhu;WANG Hai-bo

..............page:34-37

The Property Research of PP/CaCO3 Composites in Dynamic Tri-screw Extruder
WANG Yuan

..............page:31-33

The Effect of Flexible Foundation on Vibration Isolation System
ZHANG Jun-tuan;CHEN Da-wei

..............page:25-30

An Study of Period Check in Measurement
LIU Yu-xia;ZHANG Ling;WANG Li-juan;WANG Li

..............page:22-24

Assessment for Measurement Uncertainty of Electric Field Radiation for EMC
WANG Zhen-ke;SUN Guo-qiang;DING Hua;ZHANG Meng

..............page:18-21

Failure Mode and Cause Analysis of Vacuum Electronic Devices
WANG Bo

..............page:15-17

Junction-temperature Measurement and Screening Condition Determination of Power Transistor
ZHANG Yi-xuan;KONG Xue-dong

..............page:11-14

Optimized Design for Vibration-proof of Grid for Grid-controlled Electron Gun
ZHANG Yong;HE Xiao-qi;SONG Fang-fang

..............page:7-10

Evaluation Technique for Life of Gold-aluminium Bonding
LIU Jian;YAN Qing-yun;EN Yun-fei;HUANG Yun;YANG Dan

..............page:4-6

Thermal Stress Simulation for Plastic Ball Grid Array Package
SHEN Xiao-yan;YANG Heng-jing;CHI Lei

..............page:1-3