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Electronic Product Reliability and Environmental Testing
1672-5468
2006 Issue 5
Reliability of MEMS and Micromechanical Accelerometer
XU Jian-jun;KONG Xue-dong;LI Bin;SHI Qian
..............page:64-67
Finite Element Analysis for Flip Chip Solder Joint Reliability
XIAO Xiao-qing;HE Xiao-qi;EN Yun-fei;ZHOU Ji-chen
..............page:60-63
Application of Aircraft System Division in Organizing Technical Data
ZHAO Zhen-feng;CHEN Dao;GAO Jun;KUANG Zhi-li
..............page:55-59
Research on Safety Analysis Technology of Warship
LIU Bai;TANG Long-li
..............page:51-54
Discussion of Improving Measurement Accuracy of InfraScope Ⅱ
ZHANG Yi-xuan;KONG Xue-dong
..............page:43-47
Application of EMC Scanner to Development of Product
LI Hui-min;YAN Hong-hong
..............page:40-42
The Reliability Distribution Application of Tabu Search Arithmetic
WANG Hong;PAN Han-jin
..............page:37-39
Environmental Sensitivity Stresses Analysis Based on Fuzzy Comprehensive Evaluation
DENG Ai-min;CHEN Xun;ZHANG Chun-hua
..............page:18-20
Design of Fixture for Vibration Test
ZHENG Shu-li;CHANG Shao-li
..............page:14-17
The Chroma Reliability Design of High-power LED
WANG Jin;HANG Bing-wen
..............page:10-13