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Electronic Product Reliability and Environmental Testing
1672-5468
2001 Issue 3
Initial Study on the Effect of Temperature Cycling upon the Hermeticity of Semiconductor Discrete Devices
li shu jie ; li ya hong ; gao zhao feng ; wang chang he ; xu li sheng
..............
page:2-6
The Parameter Sensitivity Analysis of Reliability Prediction Models
zhang zeng zhao
..............
page:7-13
Parameter Description and Application of GaAs MESFETs Schottky Junction
huang yun ; fei qing yu
..............
page:14-19
Quality Control for Development of Electronic Components
huang zuo ; yang qing song
..............
page:20-23
Key Technology of Reliability Growth Test for Avionics
hu jing zuo
..............
page:24-29
The Problem of Moisture Deposition in Thermal Cycle Test for Unsealed Subsystem
zhang yan wei ; xia zuo ; zhu heng jing ; feng jie ; zhang zuo
..............
page:30-33
The Approach of Getting Optimal Benefit in Missile Storage- test
liu chun he ; yuan yu hua ; li jiu xiang
..............
page:34-37
Effect of Weapon Reliability on r Military Operation
niu bao cheng
..............
page:38-42
1998 International Reliability Physics Symposium
..............
page:43-47