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Electroplating & Finishing
1004-227X
2013 Issue 8
xing ye hui xun
..............page:79-79
Influence of temperature and current density on properties of high speed chromium-plated steel plate
LI Gui-bin;LI Xiu-jun;HU Bao-fu;SHI Xiao-dong
..............page:12-15
Novel bright pickling process for copper and copper alloys
ZHOU Ying;WANG Ting;SHEN Xiao;ZHANG Hong-jun
..............page:30-32
Treatment effect of electroplating wastewater using three typical flocculants
DING Yun-hu;XIAO Wei-ping;FU Nian;MAO Zu-guo
..............page:38-41
Surface properties of TiN thin film on spinning and weaving scissor made of W9Mo3Cr4V steel
LI Shou-ying;LI Quan-an;DAI Jing-jie;ZHUANG Lei
..............page:19-21
Technological properties of composite stabilizer BH for electroless nickel plating
LIANG Ying-shi;ZHANG Xiao-ming;LIN Ji-yue;HU Yao-hong;ZHAO Guo-peng;LU Xuan
..............page:16-18
Synthesis of waterborne polyurethane emulsion for architectural coating
GUO Wen-lu;JIN Zhi-ming;GAO Cai-hua
..............page:68-71
Preparation of ZnO/polystyrene superhydrophobic composite coating and its performance
QING Yong-quan;ZHENG Yan-sheng;HU Chuan-bo;WANG Yong;GONG Yong;HE Yi;MO Qian
..............page:59-63
Improvement of coating process of yellow topcoat with low covering power
HOU Yue-hua;CAO Xiao-gen;WANG Yin-yue
..............page:72-74
Preparation of silica sol/organic silicon-modified acrylate polyurethane composite
WU Wen-xin;CHEN Yao;LI Jia-xin;LAI Si-tao;HUANG Xiang-hua;CAI Xiao-min;ZHANG Ying-jiao
..............page:55-58
Study on corrosion resistance of silane/zinc composite coating
CHENG Zhun;ZENG Peng;XIE Guang-rong;LEI Min-juan
..............page:64-67
Study on electrodeposition of copper-chromium alloy
TENG Ying-xue;GUO Jing
..............page:4-7
Effects of different copper salts on copper plating in hydroxyethylidene-1,1-diphosphonic acid solution
HUANG Wei;ZENG Zhen-ou;XIE Jin-ping;LI Shu-quan
..............page:8-11
Pilot study on treatment of electroplating wastewater with MBR process in industrial park
WU Yu-hua;LEI Deng-ke;HE Xiao-jie;LIU Xiang-hu;XU Hai-liang
..............page:46-49
Preparation of nano-copper conductive adhesive from spent PCB alkaline etching solution
CHEN Shi-rong;ZHANG Yu-ting;WANG Hao;XIE Jin-ping;WU Yao-cheng;LIANG Yun-rui;LUO Xiao-hu
..............page:33-37
zhong guo zhuan li xin xi
..............page:75-78