Electroplating & Finishing 2000 Issue 6 Study of properties of cobalt-tungsten binary alloy deposit as copper barrier

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Electroplating & Finishing
1004-227X
2000 Issue 6

Study of properties of cobalt-tungsten binary alloy deposit as copper barrier
WU Yong-xin;WEN Xiao-zhong;YANG Zhi-xiong;XIAO Zu-long;LI Zhi-yong

..............page:1-7

..............page:8-10

Study of pulse jet-electrodeposition of nickel
XIONG Yi;JING Tian-fu;QIAO Gui-ying;SHAO Guang-jie;YU Sheng-xue;ZHANG Chun-jiang

..............page:11-13,41

Study of iron-nickel-phosphorus-boron electroless plating
HUANG Gui-fang;ZHAO Li-hua;WANG Ling-ling;ZHANG Jian-yong

..............page:14-16,24

..............page:20-24

..............page:25-27

A new process for zinc-series phosphating
GUO Xian-luo;WANG Hui-hua

..............page:28-30,38

..............page:31-33

..............page:34-38

Determination of free sulfuric acid in acid tin plating bath
LONG You-qian;XIAO Xin;WANG Huan-long;TAN Zheng-de;HU Xin-liang

..............page:39-41

..............page:42-48

Preparation of acid zinc plating brighteners
WANG Zong-xiong;SHANG Shu-ding

..............page:49-51

..............page:52

..............page:53,57

..............page:54-57

..............page:58-60

..............page:17-19