1000-4742
2013 Issue 5
Study of Chromium-Free Passivation Process for Electrogalvanized Coating
ZHANG Jin-qiu;AN Mao-zhong;LI Chong-xing;YANG Pei-xia
ZHANG Jin-qiu;AN Mao-zhong;LI Chong-xing;YANG Pei-xia
..............page:33-36
A Research on Composite Electroplating of Finishing Ni-SiO2 on Automobile Cylinder Inner Wall
CHEN Ning
CHEN Ning
..............page:1-3
A Study of Technology and Corrosion Resistance of Electrodeposited Nickel Layer on Magnesium Alloy Surface
YAN Li;CHU Li-ying;WU Hua;LI Xue-song
YAN Li;CHU Li-ying;WU Hua;LI Xue-song
..............page:7-9
..............page:18-20
A Study of Optimizing Electroless Ni-Fe-Co-P Plating Process Based on BP Neural Network Method
XU Hu;JIA Ying;FENG Cheng;WANG Xing-yun
XU Hu;JIA Ying;FENG Cheng;WANG Xing-yun
..............page:41-44
Mass Transfer Characteristics of Supercritical Fluid Electroformed Metal Microstructure
WANG Xing-xing;LONG Wei-min;HAN Shuang;L(U) Deng-feng;LEI Wei-ning;LIU Wei-qiao
WANG Xing-xing;LONG Wei-min;HAN Shuang;L(U) Deng-feng;LEI Wei-ning;LIU Wei-qiao
..............page:24-27
Effects of Cl-on Texture of Copper Coating
QU Cheng;ZHU Cheng-fei;YUAN Ju;YAO Li-jun
QU Cheng;ZHU Cheng-fei;YUAN Ju;YAO Li-jun
..............page:13-15
Influence of Particle Electrical Conductivity on Structure and Properties of Composite Coating
HU Hong-wei;LI Xiao-yan
HU Hong-wei;LI Xiao-yan
..............page:31-33
A Study of Treating Electroplating Wastewater by Electric Coagulation and Biosorption
HUANG Xiao-bing;ZHANG Hai-tao;L(U) Yan-chun;CHEN Hong-hui;YANG Ji-feng;CHEN Ya-chao
HUANG Xiao-bing;ZHANG Hai-tao;L(U) Yan-chun;CHEN Hong-hui;YANG Ji-feng;CHEN Ya-chao
..............page:45-47
..............page:9,20,23,27,30,40,53,56
chu tan hua xue fa chu li dian du fei shui de li lun ji chu
wang ke he ; wei xue qing ; wang hai yan
wang ke he ; wei xue qing ; wang hai yan
..............page:54-56
Effects of Non-bright Factors on Coating Quality in Acid Bright Copper Plating Process
LI Li-qing;LI Min;YANG Li-qin;FAN Qi-zhe;BI Sheng-long
LI Li-qing;LI Min;YANG Li-qin;FAN Qi-zhe;BI Sheng-long
..............page:21-23
dian du zhuan ye da xue sheng de zhuan ye si xiang wen ti tan xi
wan chuan yun ; gu wei zhong
wan chuan yun ; gu wei zhong
..............page:51-53
du xi zhi liang wen ti pai chu yi li
hou xi lin
hou xi lin
..............page:50
A Study of Neutral Citrate Solution Nickel Plating Process
LI Yan-wei;SHANG Xiong;YAO Jin-huan;JIANG Ji-qiong;DENG Xing-shen
LI Yan-wei;SHANG Xiong;YAO Jin-huan;JIANG Ji-qiong;DENG Xing-shen
..............page:4-6
An Investigation on Different Activation Processes for Electroless Plating on AZ 31 Magnesium Alloy
WANG Juan;DING Yi;YIN Ming-yong;MA Li-qun
WANG Juan;DING Yi;YIN Ming-yong;MA Li-qun
..............page:37-40
A Study of Cyanide-Free Pulse Silver Plating on Pure Copper
CHEN Yi-bing;ZHAO Fang-xia;SUN Xiao-dong;ZHANG Zhen-zhong
CHEN Yi-bing;ZHAO Fang-xia;SUN Xiao-dong;ZHANG Zhen-zhong
..............page:15-17
Electrochemical Deposition and Magnetic Properties of Ni-Co Magnetic Film
CAO Ying;GE Hong-liang;WEI Guo-ying;YU Yun-dan;LOU Jun-wei;MENG Xiang-feng
CAO Ying;GE Hong-liang;WEI Guo-ying;YU Yun-dan;LOU Jun-wei;MENG Xiang-feng
..............page:28-30
Effects of Reverse Ratio on Corrosion Resistance of Ni-Fe Alloy Coatings Prepared by Pulse Electroplating
SUN Dong-lai;CHEN Ji;CHU Gang;CHUAI Guo-dong;SHI Yan-hua;LIANG Ping
SUN Dong-lai;CHEN Ji;CHU Gang;CHUAI Guo-dong;SHI Yan-hua;LIANG Ping
..............page:10-12
xian dai lin hua cai liao yao li wen da ( )
tang chun hua
tang chun hua
..............page:48-50