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Electroplating & Pollution Control
1000-4742
2008 Issue 6
Brief Discussion on Peeling in Hard Chromium Plating
ZHANG Yan-hong;ZHOU Ya-jiao
..............page:46
Troubleshooting for Plating Toilet Utilities
CHEN Wu-chu
..............page:48
Application of Palladium-Nickel Plating on Printed Circuit Boards
YANG Qiu-fu;XIN Jian-shu
..............page:44-45
Effecs of Equipment on Electroplating Process and Coating Quality
CUI Ting-chang;ZHANG Su-lan
..............page:43-44
Quick Determination of Sn2+ and NaH2PO2 in Electroless Tin Bath
XIANG Hai-feng;LI Ning;LI De-yu
..............page:40-42
Monitoring of Electroplating Wastewater(Ⅶ)
DAI Yong-shen;PEI Ru-jun;DAI Hui
..............page:34-37
Study of Anodizing Al-Li Alloy and Properties of the Anodization Film
MA Zong-yao;XIE Fa-qin
..............page:31-34
Investigation on Anodization of AZ 31 Mg Alloy
DONG Guo-jun;GONG Fan;GUO Yan
..............page:28-30
Development of Self-Lubricating Dacromet Coating
LI Xiao;CHEN Ling;JIAO Ming-quan;WANG Zai-de;ZHOU Yang
..............page:22-23
Research on Preparing Massive Porous Nickel by Jet-Electrodeposition
YANG Cheng-bo;TIAN Zong-jun;LIU Zhi-dong;CHEN Jin-song;WANG Gui-feng
..............page:18-21
Preparation of Diamond Tools with Nanocrystalline Ni-Co Alloy Electrodeposit
LI Yun-dong;WANG Huai-dong;LI Libo;LU Hui-yang
..............page:15-17
Research on Additives for Acid Copper Plating on Printed Circuit Boards
ZHU Feng-juan;LI Ning;LI Deyu
..............page:10-14
Research on Amorphous Ni-Cu-P Alloy Plating
CHEN Hai-yan;ZHU You-lan;SHU Chang;ZHANG Zeng-yuan
..............page:7-9
Influence of Manganese Element on Nickel Deposit
SUN Shu-ping;LI Xiao-bo
..............page:5-7