1001-3849
2016 Issue 12
Electrodeposition Preparation and Corrosion Resistant Behavior of Ni-AlN Nanocomposite Coatings
ZHANG Qinghui;,SHEN Xixun;,CHENG Danhong;,XU Qunjie;
ZHANG Qinghui;,SHEN Xixun;,CHENG Danhong;,XU Qunjie;
..............page:1-5,22
..............page:6-11
Study on Microstructure and Properties of Ultrasonic Micro Electroforming Nickel Parts
XUE Jinhai;,WU Menghua;
XUE Jinhai;,WU Menghua;
..............page:12-14,28
Research Progress of the Interactions among the Additives of Copper Electroplating in PCB Manufacturing
PENG Jia;,CHENG Jiao;,WANG Chong;,XIAO Dingjun;,HE Wei;
PENG Jia;,CHENG Jiao;,WANG Chong;,XIAO Dingjun;,HE Wei;
..............page:15-22
Fault Information Analysis and Monitor of Electronic Connector Continuous Plating
TAO Li;,TU Jingwen;
TAO Li;,TU Jingwen;
..............page:23-28
Causes Analysis of Black-spot and Process Optimization on Nickel Electroplating of Thin-wall Copper Parts
HAN Yanbin;,WU Zhiyong;,DU Dongxing;,TANG Zuoqin;,DENG Sanping;
HAN Yanbin;,WU Zhiyong;,DU Dongxing;,TANG Zuoqin;,DENG Sanping;
..............page:29-31,36
Performance Comparison of Wear-resistant and Lubricating Coating applied in Electronic Equipment
NAN Tao;
NAN Tao;
..............page:32-36
Design of Process Parameters Automatic Detecting System for Trivalent Chromium plating
LI Wei;,DING Ting;
LI Wei;,DING Ting;
..............page:37-41
Determination of Ammonium Citrate Content in Pyrophosphate Electroplating Copper solution
OUYANG Fei;,XU Yuan;,XU Xiaoping;,HUANG Fuqin;,ZHANG Xiangding;,YANG Yuan;,LIU Jiandong;
OUYANG Fei;,XU Yuan;,XU Xiaoping;,HUANG Fuqin;,ZHANG Xiangding;,YANG Yuan;,LIU Jiandong;
..............page:42-43
..............page:44-46