1001-3849
2013 Issue 8
..............page:44-46
Chromium-free Etching Method for Polycarbonate Engineering Plastics
ZHAO Wen-xia;WANG Zeng-lin
ZHAO Wen-xia;WANG Zeng-lin
..............page:1-6
Application of EDTA in Electroless Copper Plating
LIU Cun-hai;LUO Yuan
LIU Cun-hai;LUO Yuan
..............page:33-35
Preparation of Ni3.1B Amorphous Nano Alloy Particles for Electroless Composite Plating
WANG Yu-rong;WANG Wen-chang;SHI Jian-hua;MITSUZAK Naotoshi;CHEN Zhi-dong
WANG Yu-rong;WANG Wen-chang;SHI Jian-hua;MITSUZAK Naotoshi;CHEN Zhi-dong
..............page:7-11
Fault and Troubleshooting of Bright Dots During Black Filling of Anodic Oxidation Film on Duraluminum Alloy
WANG Jian-chao
WANG Jian-chao
..............page:41-43
Progress in Electrodeposition of Alloys from Ionic Liquid
LI Qing-yang;AN Mao-zhong;LIU An-min;REN Xue-feng
LI Qing-yang;AN Mao-zhong;LIU An-min;REN Xue-feng
..............page:26-32
Methanol Electro-oxidation on Titanium Electroplated with Ni-P Deposits
XU Yue;TAO Xiong-xin
XU Yue;TAO Xiong-xin
..............page:21-25
Effect of Additives on the Copper Filling Microvia in an High Acid and Low Copper Plating Solution
YAO Long-jie;LU Xu-bin;REN Shao-jun;WANG Zeng-lin
YAO Long-jie;LU Xu-bin;REN Shao-jun;WANG Zeng-lin
..............page:15-20
Development History and Application of Vacuum Ion Plating Technology
CHEN Bao-qing;DONG Chuang
CHEN Bao-qing;DONG Chuang
..............page:36-40
Thermodynamic Alalysis of Electrodeposited Cu-Mo-Co Alloys
LI Yuan-hui;WANG Hai-feng;HUANG Bi-fang;ZHANG Xiao-yan;GUO Zhong-cheng
LI Yuan-hui;WANG Hai-feng;HUANG Bi-fang;ZHANG Xiao-yan;GUO Zhong-cheng
..............page:12-14,25