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Plating & Finishing
1001-3849
2012 Issue 7
Investigations on the Effect of Surfactant OP-10 on Nickel Electrodeposition from Sulfate Electrolyte
LI Yan-wei;HUANG Xiao-xi;SHANG Xiong;JIANG Ji-qiong;ZHU Yan-xi
..............page:20-24
xin xi dong tai
..............page:24,37
Effects of Process Parameters on the Electrolytic Refining Copper Layer Structure
YUAN Ju;ZHU Cheng-fei;QU Cheng;YAO Li-jun
..............page:1-4
An Effecting Factor Analysis on Second Bond Delamination in LQFP Packages
WANG Jin-sheng;YE De-hong;GAO Wei;CHEN Quan;GUO Hui-hui
..............page:25-30
Manufacturing of Fine Lines by Semi-additive Process with Electroplating
CHEN Yuan-ming;HE Wei;HUANG Zhi-yuan;HUANG Tong-bin;WANG Wei;ZHU Meng;WANG Ze-yu
..............page:5-8,13
Quality Control of Radar Absorbing Coating
ZHAO Xin;GUO Yi-wei
..............page:35-37
Effects of Potential Applying Mode on Morphology of TiO2 Nanopore Films Prepared by Anodic Oxidation
LI Fei-hui;CHEN Lei;GONG Yun-lan;LI Jian-ying
..............page:38-40