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Plating & Finishing
1001-3849
2012 Issue 3
An Electroless Copper Plating Process Using Glyoxylate as Reductant
YANG Fang-zu;YAO Guang-hua;ZHOU Shao-min
..............page:1-5
xin xi dong tai
..............page:后插3-后插7,5,33
The Comparision of Corrosion Resisting Property of Conductor Surface of RF Connector
JING Xing-bin;LIU Jin-yi;ZHANG Bao-gen
..............page:18-22,46
Preparation and Researching Progress of Electromagnetic Shielding Packing
ZHANG Ning;SHAO Zhong-cai;LI Xiao-wei
..............page:28-33
Investigation of Passivation Technology and Corrosion Resistance for Molybdate Passivation Film Formed on Zn-Al Galvanized Steel Sheet
WANG Jian;ZHOU Wan-qiu;SHI Yao-Ping;KANG Yan-hong;SHENG Li;WANG Bo
..............page:6-9
Maintenance of Bright Nickel Barrel Plating Bath
GUO Chong-wu
..............page:34-38
Research Progress of the Additives Behavior in Zinc Electrowinning
LIU Jian-hua;GUO Zhong-cheng;CHEN Bu-ming;SHI Feng-bang
..............page:23-27
Processing Technology and Corrosion Resistance of Silane Film on Aluminum Alloy
WANG Liang;XUAN Tian-peng;ZHOU Yun;ZHANG Wan-li
..............page:13-17
ren wu jie shao
..............page:后插7
Brief Introduction of Atomic Absorption Technique(H)(the end)
QIU Xing-chu;QIU Shan;QIU Sheng;CHU Rong-bang
..............page:42-46