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Plating & Finishing
1001-3849
2011 Issue 1
Application of a New Material for Cleaner Gold Plating in Gold Plating Technology
ZHANG Lei;HU Wen-cheng;MA Mo-lei;ZHANG Yong-qiang
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page:10-15
Development of Research on The Non-chromium Dacromet Technology
KE Chang-mei;WANG Quan-quan;HU Yong;ZHOU Li-qin
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page:16-19,41
The Inhibition Effects of N,N-Dimethylformamide Self-assembled Films for Copper
XIANG Yong-gang;WANG Chun-tao;WANG Jing;HAN Ji-hong
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page:35-37
Simultaneous Determination of Copper and Iron in Plating Bath by Dual-Wavelength Spectrophotometry
TANG Zhu-xing;WANG Hao
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page:38-41
Residual Stress of Ni Coatings Prepared by Laser Enhanced Electro-brush Plating
YAN Tao;LIANG Zhi-jie
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page:6-9
xin xi dong tai
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page:5,15,26,37,45-46,后插2
Composite Electroless Plating(Ni-P)-Si3N4 Nanoparticle Composite Coating on Polyamide Fabric
ZHANG Hui;FENG Yi-wei
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page:1-5
Bright Zn-Ni alloy Electroplating in Pyrophosphate Citrate Bath
CAO Lang;ZUO Zeng-zhong;TIAN Zhi-bin;ZHAN Yi-teng
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page:30-34
High Quality Painting Technology for Magnesium Alloy Parts
XU Guan-qing;LUO Si-hai;LIN Jian-bin
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page:24-26
Research Progress of Electrochemical Method for Preparing Multilayer Coating
LIU Xin-yuan;HAO Jian-jun
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page:20-23,41
Improvement of Electric Connection Mode for Aluminum Alloy Hard Anodic Oxidation
CHANG Yong-fu;GU Bao-nan;ZHANG Shu-zhen;SHI Xiao-hang
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page:27-29
Spectrophotometric Determination of Copper, Iron and Nickel Impurities in Chrome Plating Bath
GUO Chong-wu
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page:42-44