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Plating & Finishing
1001-3849
2010 Issue 2
Elimination of a Decorative Chromium Plating Malfunction
guo chong wu ; xiang si jie
..............
page:24-26
Study on Copper Strike Electroplating Technology in Alkaline Cyanide-free Bath
hu de yi ; yuan yan wei ; liu bao ; guo shu ling ; wang jin ling
..............
page:11-14
Effect of Anion of Ammonium Salt on Suspended TiO2 Photoelectrocatalysis Activity
zhou li na ; bai jia wei ; li zuo zuo ; zhang wen jie
..............
page:7-10
Qualitative and Quantitative Determination of Iron Impurity in Four Types of Common Plating Baths
feng kai wen
..............
page:37-38
Characteristics of Bonding between Copper Coating Electroless Plated on Ni Ion Implanted Al2O3 Ceramic Surface and Substrate
wang xiao hong ; zhu zuo zuo ; sun zhi
..............
page:1-3,26
Application Progress of Sonoelectrochemical Technology for Preparing Nanomaterials
wang hong zhi ; zhang zhi xian ; miao rong rong ; yao su zuo ; zhang wei guo
..............
page:15-20
EXPERIENCE EXCHANGE
..............
page:14,20,43
Study on the Adsorption Properties of Humic Acid and its Resin for Cr(Ⅲ)
fan jian feng ; song mei rong
..............
page:4-6,33
Analyses of Defects of Nickel Salt Electrolytic Coloring for Aluminum Profiles after Anodic Oxidation
jiang wei ; xu jun ; di jun ; zhao yu jun
..............
page:21-23
Removal Technology of Copper and Nickel from Electroplating Sludge——Removal of Copper and Nickel by Electrolysis
li pan pan ; peng chang sheng
..............
page:39-43
PATENT EXAMPLE
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page:44-46
Influencing Factors on Etching Rates of Stainless Steel
fu yu zuo ; ba jun zhou ; jiang ya xiong ; yan fei xue
..............
page:34-36
Pepair Painting for Integral Engineering Machine
wang chun ying ; zhang wei hong ; zhang rui
..............
page:27-29
Brief Discussion on Total Quality Management for Electroplating Enterprise
wang hong kui
..............
page:30-33