Plating & Finishing 2010 Issue 10 Future Electroplating Mode and Possible Technological Improvement Programs

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Plating & Finishing
1001-3849
2010 Issue 10

Future Electroplating Mode and Possible Technological Improvement Programs
LIU Ren-zhi

..............page:21-24

A New Type of Electroless Copper Plating with Iminodiacetic Acid as Complexing Agent
GAO Jian;YUAN Xue-li;YANG Zhi-feng;WANG Zhi-xiang;WANG Zeng-lin

..............page:5-8

History of Korean Electroplating Industry Cooperation Association and Trends of the Electroplating Industry
SHEN Zheng-ji

..............page:42-44

Preparation of the Certified Reference Materials (CRMs) of Anodic Oxidation Coatings on Aluminum Alloys——Preparation of the CRMs and Uniformity and Stability Tests of Coating Thickness
SUN Feng-xian;JI Hong;LI Yong-feng;LIU Ying

..............page:38-41

Effect of Ultrasonic Cleaning after Passivation on Corrosion Resistance of Tin Coating
ZHAO Li-xin;SHAO Ying;SHAO Zhong-cai;LI Guang-yu

..............page:9-11

Application of Native Botanical Materials in Electroplating Wastewater Treatment
LI Chen

..............page:25-30

Investigation on Rare Earth Salt Passivation Technology for Aluminum Alloy
WANG Chun-xia;ZHOU Ya;CAO Jing-qian;SHAO Zhi-song

..............page:31-33,37

xin xi dong tai

..............page:8,45-46

A Study on Dim Streaks Phenomenon in Single Nickel Salt Electrophoretic Coloring of Shaped Aluminum Materials
JIANG Wei;MA Yue-hui;ZHAO Yu-jun

..............page:34-37

Research Progress of Surface Treatment Techniques for Titanium Alloys
JIANG Hai-tao;SHAO Zhong-cai;WEI Shou-qiang

..............page:15-20

Development of an Environment Friendly Water-based Degreasing Agent
WANG Hui;ZHAO Yong-wu;WANG Yong-guang

..............page:12-14

Nucleation Mechanism of Copper Electrodeposition on Graphite Substrate
ZHAO Xi;XU Qiang;DING Fei;LIU Xing-jiang

..............page:1-4