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Plating & Finishing
1001-3849
2008 Issue 6
jian xun
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page:17
TECHNIQUE EXCHANGE WINDOW
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page:9,27,36
PATENT EXAMPLE
QIN Qi-xian
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page:44-46
QUESTIONS AND ANSWERS
WANG Shi-lu
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page:43
Design for Electroplating Plants Based on Cleaner Production
XIANG Rong
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page:40-42
Simultaneous Determination of Chromium(Ⅵ) and Manganese(Ⅶ) by Carmine Fading Differential Rate Spectrophotometry
LI Li;Zhang Dong
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page:37-39,42
Analysis of Copper Impurity in Trivalent Chromium Plating Bath
GUO Chong-wu;YI Sheng-fei
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page:34-36
Study on Mid-temperature Zinc Calcium System Phosphating Solution
HAN En-shan;XU Han;FENG Zhi-hui
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page:31-33
Polarization of Electrode and Polarization Curve (Ⅰ)——Polarization of Electrode
QIN Qi-xian;LIU Shu-lan
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page:28-30
Improvement of Mirror-like Finishing Technology for Rollers
LI Wei-quan
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page:25-27
Application of Sulphamate Baths in Electroplating on Crystallizer Copper Plate
CAO Xu;LI Ning;LI De-yu;JIANG Li-min;HUANG Li
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page:21-24,33
Studies on Non-chromium Acidic Electropolishing of Aluminum Alloy
LI Min-jiao;ZHANG Shu-lin;WANG Xiao-bo;LUO Yi
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page:18-20,27
Chemical Stripping Copper in KBrO3-NH3·H2O-NH4NO3 Solution
LIU Xiao-yang;LI Guo-xi;ZHU Ri-long;ZHENG Jun-hui
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page:14-17
Study on Electro-assisted Photocatalysis of TiO2 Films Using Micro-arc Oxidation
SU Hui-dong;HAO Qing-wei
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page:10-13
The Research of Molybdate and Molybdate-phosphate Conversion Films on Magnesium Alloy
ZHU Jing;YONG Zhi-yi;QIU Chen;HAO Rui;LIU Ya-li
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page:6-9
Influence of Pulse Parameters on the Structure and Hardness of Electroforming Copper
GUAN Li-ya;ZHENG Xiu-hua;WANG Fu-chi;LI Shu-kui;WANG Xiang-yu;LV Guang-shu
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page:1-5