Plating & Finishing 2008 Issue 2 Effect of Process Conditions on the Microstructure of the Immersion Zinc Layer on Aluminium Alloys

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Plating & Finishing
1001-3849
2008 Issue 2

Effect of Process Conditions on the Microstructure of the Immersion Zinc Layer on Aluminium Alloys
HUANG Xiao-mei;ZHANG Mi-lin

..............page:34-37

The Role and Function of the Electroplating Enterprises Playing in the Circulation Economy
YANG Hui

..............page:30-33

Preliminary Discussion on Electroplating Production Management (Ⅱ) (the end)
LIU Ren-zhi

..............page:27-29,37

Electric Conductivity of Electroplating Bath
QIN Qi-xian;LIU Shu-lan

..............page:24-26

High Speed Tin Plating Technology and Its Troubleshooting
HAO Li-feng;WANG Ming-sheng

..............page:21-23

Surface Treatment of Copper Foil for PCB
LIU Shu-zhen

..............page:17-20,23

Status of Chromium-free Chemical Conversion Film on Magnesium Alloy
CHENG Jin-ning;SUN Ling;HU Hui-li;LI Ning

..............page:11-16

Application and Research Progress of Hot Dip Aluminizing Technology
WU Di;LIU Bing;YI Da-wei

..............page:7-10

Effect of Heat Treatment on Bonding Strength and Microhardness of Ni-P Coating
WANG Li-li;GUAN Cong-sheng;SUN Cong-zheng

..............page:4-6

Effects of Current Density on Micro-arc Oxidation of Hot-dip Aluminized Coating on Stainless Steel
ZHANG Yu;YAN Kang-ping;WANG Wei;TIAN Jian

..............page:1-3

TECHNIQUE EXCHANGE WINDOW

..............page:3,33,37

PATENT EXAMPLE

..............page:44-46

Questions and Answers about Hard Chromium Plating Technology
XI Bing

..............page:43

Analysis for Iron Impurity in Tervalent Chromium Plating Bath
GUO Chong-wu;YI Sheng-fei

..............page:40-42

Application of Cupron Spectrophotometry Determining Copper in Electroplating (Ⅱ) (continued to Ⅰ)——Determination of Copper Impurity in Various Plating Bathes
DAI Yong-sheng;PEI Ru-jun;DAI Hui

..............page:38-39