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Plating & Finishing
1001-3849
2004 Issue 1
zhong guo guo ji biao mian chu li zhan
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page:45
liang zhong du ge dian jie ye
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page:12
zai lv ji qi he jin shang zhi jie dian du tie
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page:8
zhuan li shi li
zuo qi xian
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page:46
Elementary Knowledge of Plating Bath Analysis (Ⅳ)
dai yong sheng
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page:42-45
Au-Sn Alloy Electroplating
wang li li
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page:38-41
Improvement of Lead Determination Method in Fluorboric Acid Pb-Sn Alloy Plating Bath
li cheng hong
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page:37-37
Rapid Analysis of Rhodium in Rhodium Plating Bath
qiu shan ; qiu xing chu ; huang shu ming
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page:34-36
Rapid Determination of Nickel Sulfate and Sodium Hypophosphite in Electroless Nickel Plating Bath
xu qi wen ; wu yuan qing ; huang yue shan ; zhao xiu hua
..............
page:31-33
Fabrication of Hydrogen-evolution Electrodes with High Catalytic Activity by Electrochemical Technology
li ke feng ; wang wei ; ju feng ; qian wen zuo
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page:27-30
Gold Plating Process of Silver Alloy Ornaments
wu shuang cheng
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page:25-26
Sulfamate Nickel Plating Process for Printed Circuit Board
yang qiu fu
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page:23-24,26
Preparing Bioactive Ceramic Coating by Electrochemical Method
kang jian qiang ; wu hui min ; li wei dong ; zuo zheng zhong
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page:18-22,30
Copper Electrodeposition in ULSI
gu min ; yang fang zu ; huang ling ; yao shi bing ; zhou shao min
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page:12-17
Study of (Ni-W)-PTFE Composite Electrodeposition
du ke qin ; kou zuo ; yan chuan wei
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page:9-12
Study on Pretreatment Technology for Electroless Nickel Plating on Hollow Glass Microspheres
wu ; zhang qiu yu
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page:5-8
Study of Electrochemical Characteristics and Structure of Electroless Plated Co-B-Y Alloy
xuan tian peng ; zuo dan ; zhang lei ; huang qin hua
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page:1-4