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Plating & Finishing
1001-3849
2004 Issue 1
liang zhong du ge dian jie ye
..............page:12
zhuan li shi li
zuo qi xian
..............page:46
Elementary Knowledge of Plating Bath Analysis (Ⅳ)
dai yong sheng
..............page:42-45
Au-Sn Alloy Electroplating
wang li li
..............page:38-41
Rapid Analysis of Rhodium in Rhodium Plating Bath
qiu shan ; qiu xing chu ; huang shu ming
..............page:34-36
Rapid Determination of Nickel Sulfate and Sodium Hypophosphite in Electroless Nickel Plating Bath
xu qi wen ; wu yuan qing ; huang yue shan ; zhao xiu hua
..............page:31-33
Fabrication of Hydrogen-evolution Electrodes with High Catalytic Activity by Electrochemical Technology
li ke feng ; wang wei ; ju feng ; qian wen zuo
..............page:27-30
Gold Plating Process of Silver Alloy Ornaments
wu shuang cheng
..............page:25-26
Sulfamate Nickel Plating Process for Printed Circuit Board
yang qiu fu
..............page:23-24,26
Preparing Bioactive Ceramic Coating by Electrochemical Method
kang jian qiang ; wu hui min ; li wei dong ; zuo zheng zhong
..............page:18-22,30
Copper Electrodeposition in ULSI
gu min ; yang fang zu ; huang ling ; yao shi bing ; zhou shao min
..............page:12-17
Study of (Ni-W)-PTFE Composite Electrodeposition
du ke qin ; kou zuo ; yan chuan wei
..............page:9-12
Study of Electrochemical Characteristics and Structure of Electroless Plated Co-B-Y Alloy
xuan tian peng ; zuo dan ; zhang lei ; huang qin hua
..............page:1-4