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Plating & Finishing
1001-3849
2002 Issue 3
Preparation of Cu and Ni-P Nano-Powderby Electroless Plating
chen hong ; kuang ya fei ; zhou hai zuo ; luo sheng lian ; chen jin hua
..............page:1-4
Study of Brightener for Acidic Copper Plating
zuo zheng xun ; ma chong ; wang zhi jun ; chen yong yan
..............page:5-8
Non-chromium and Low-chromium Passivationof Tin-Zinc Alloy Coatings
zhang jing shuang ; xia bao jia ; tu zhen mi ; an mao zhong
..............page:9-11
Dependence of Ceramicization ofAluminium Alloy Surface on Pretreatment
wang zong ren ; kong qing shan ; gong gui fen
..............page:15-18
A New Technology for Gold Salt Production
zhang dong shan
..............page:19-21
Advance of Electrochemical Composite Treatmentfor Aluminum and Aluminum Alloys
luo sheng lian ; zeng xiang yong ; kuang ya fei ; zeng ling san
..............page:22-26
Application and Spread of Pulse Power Supplyfor Electroplating
han miao xing ; he yong fu
..............page:27-29
Pearl Like Nickel Plating
song yi ren ; shen ya guang
..............page:33-34
Drying of Coated Articles
zheng rui ting
..............page:35-36
Jig Design for Powder ElectrostaticCoating of Complex Trunks
yang yong ying ; zuo wei jian ; li jun song
..............page:37-38
Comparison of Neutral Salt Spray Test Methodsin Domestic and Abroad
liu ji zuo ; duan zhi hao
..............page:39-40
Process of Nickel Electroless Plating
wang li li
..............page:41-43
QUESTIONS AND ANSWERS
zheng rui ting
..............page:44-44
PATENT EXAMPLE
jia qi xian
..............page:45-46
Market Economy is Credit Economy
lu lu
..............page:46-46
bi geng xu zhi
..............page:8-8
dian chen ji nie yang mo
..............page:4-4