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Plating & Finishing
1001-3849
2002 Issue 2
hui yi bao dao
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page:8
Transmitting Information and Extending Exchange SHU Huai
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page:46
Translated and Compiled by QIN Qi-xian
jia qi xian
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page:45
QUESTIONS AND ANSWERS
zheng rui ting
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page:44
Process of Copper Electroless Plating
wang li li
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page:42-43
Treatment of Phosphorus Containing Waste Water
gong ben tao ; yuan hao ; gong you fu ; li yong de ; tang ji lu
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page:38-41
A New Technology of Electroplating Waste Water Treatment by Microbes
li fu de
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page:35-37
Improvement of Bath Circulation Way in Aluminum Shape Materials Oxidation
yan jian hui ; cai zuo
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page:33-34
Technology Management of High Speed and Continuity Silver Partial Plating
zhong heng jiang
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page:31-32
Technology of Tin and Tin-Lead Alloy Plating of Microelectronic Tube
lu jin long
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page:28-30
Electrodeposition of Palladium and Its Alloys
yang fang zu ; huang ling ; yao shi bing ; xu shu kai ; zhou shao min
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page:20-27
Zincate Zinc Plating with Off-line Activation
liang jin hua ; ji gang
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page:15-19
An Investigation on Additives in Methanesulfonic Acid Tin-Lead Alloy Electroplating
he hua lin ; wu qiao shun
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page:13-14,27
Development and Application of Additive for High Corrosion Resistant Colored Phosphating Film
meng de jun
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page:9-12
Study on Anodizing and Electrolytic Coloring Golden-yellow Color Series on Aluminium Shape Materials
liu zuo li ; liu shen ; zuo diao he ; li zuo ; liu hai feng
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page:5-8
Composite Anodizing of Aluminium in Sulfuric Acid SolutionⅣ. Anodizing Process of Aluminium in Sulfuric Acid Solution Added SiC Powder
luo sheng lian ; zeng xiang yong ; kuang ya fei ; zeng ling san
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page:1-4