Plating & Finishing 1999 Issue 6 Translated and Compiled

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Plating & Finishing
1001-3849
1999 Issue 6

Translated and Compiled
Qin Qixian

..............page:34-35

Exploration of Treatment Technique of Electroplating Waste Water with Biology Method
Cheng Min

..............page:32-33

Determination of Copper in Acidic Copper Plating Bath
Sun Yufeng

..............page:31

Photometric Determination of Palladium in Palladium-Nickel Plating Bath
qiu xing chu ; chen hua xiang ; qiu shan ; he wei ming ; liu chun zuo

..............page:29-30

Quality Problems of Iron Base Materials Zinc Electroplating
Zhang Jing

..............page:27-28

Superficial Discussion on Arrangement of Anode in Electroplating Tank
Wang Yuanfang;Bi Aiwen

..............page:25-26

Electroplating of Copper Tin Zinc Ternary Alloy on Stainless Steel
Luo Yaozong

..............page:23-24

Chronicle of Major Events of Tianjin Electropla-ting Industry in Reformation and Opening 20 Years
Wang Shilu;Liang Qimin;Ma Xueyi

..............page:18-22

Assesment of Direct Electroplating Technology for Printed Circuit Board Metallization
Shi Ping;Li Guiyun

..............page:15-17

Exploration on Mechanism and Method of Gold Coating Salt Spraying Test
Zheng Guanlin

..............page:11-14

Technology of Alkaline Tartarate Lead Plating on Plastics Substrate
Qiu Xungao;Wang Zheng;Xiang Guopu

..............page:8-10

Research on the Vibratory-Sieve Electroplating Technique for the Cover of IC Ceromic Package
Xu Weiyuan;Ma Jindi;Shen Zhuoshen;Hou Jin

..............page:6-7

Advance of Nanometer Materials
Wu Jun;Wang Longbiao;Huang Qingan;Yu Jiangxian;Chen Yongyan

..............page:1-5