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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2016 Issue 6
Silver Sintering Technology for Power Module Packaging Application
LI Cong-cheng;,TENG He-song;,WANG Yu-lin;,XU Wen-hui;,NIU Li-gang;
..............page:311-315
Research on Delamination and Reliability of Military Plastic Encapsulated Microcircuits
WANG Xiao-zhen;,XIONG Sheng-yang;,ZHANG Wei;,WANG Shu-sheng;
..............page:316-319,326
RF Vertical Interconnection for Chip-Scale Integrated
WANG Hui;,XIANG Wei-wei;,LU Yin-quan;,LIU Zhi-hui;
..............page:320-322,326
Study on Reliability of Tin-Lead Eutectic Solder Joint in Cryogenic Environment
xu xing ;, chen gai qing ;, cheng ming sheng ;
..............page:323-326
Discussion of Blow Hole in Lead-free Wave PTH Solder Joint
LI Xiao-qian;
..............page:327-329
Effect of Baking QFN Device on Solderability of Pure Tin Plating
SUN Xiao-wei;,CHENG Ming-sheng;,ZOU Jia-jia;,JIANG Jian-qian;
..............page:330-332,352
Reason Analysis of Deformation for Soldered Module
ren kang ;, liu bing jin ;, bo ying ;
..............page:333-335,352
Research on Reliability of 3D-Plus Memory Stacks on PCB
LV Qiang;
..............page:336-338,359
Mechanical Reinforcement Technology Research of CQFP in Aerospace Industry
WU Guang-dong;,REN Jiang-yan;,WANG Xiu-li;,YAN Gui-sheng;,DING Ying;
..............page:339-341,363
Infl uence of Laser Seal Welding Technology Parameters on Gas Tightness of Aluminum Alloy Module
WANG Cheng;,SUN Hu-hao;,CHEN Cheng;
..............page:342-344
Failure Reason Analysis and Measures for Solder Joint Cracking of A LCCC
li xue ;, wang ze xi ;, yang shuai ju ;
..............page:348-352
Research on Assembly Processing of Feed Insulator For Microwave Module
CHEN Cheng;,YU Chun-yong;
..............page:353-355
Research on Refl ow Soldering Process of Thick Film Hybrid Integrated Circuit
ZHU Ming-feng;,ZHUANG Jian-qing;,WANG Yang;
..............page:356-359
Application of Bonding Technology in Military Electronic Equipment
YANG Wei;,ZHONG Fu-xian;,LI Jian-ping;,MAO Jiu-bing;
..............page:360-363
Design and Improvement of a Eccentric Wheel Clamping Mechanism
ZHANG Hui-jun;,DUAN Qing-peng;,JIA Ping-ping;,WANG Fang;,ZHAO Nai-hui;
..............page:364-366
Analysis and Optimization of Solar Cell Surface Dirt During Transmission
XI Si-nan;,WANG Peng-peng;
..............page:367-369
geng zheng
..............page:372-372