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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2016 Issue 3
Interconnect Techniques between Thin-Film Sensors and Leads Using Parallel Micro Gap Welding
WANG Chen-xi;,TIAN Yan-hong;,WANG Chun-qing;
..............page:125-127,134
Development of Synthesis Methods and Technology for SiC Powder Used for Single Crystal Growth
MA Kang-fu;,WANG Ying-min;,LI Bing;,XU Wei;
..............page:128-134
System on Package Design Based on Vertical Interconnection of Fuzz-button
LIU Jiang-hong;,lIU Chang-jiang;,LUO Ming;,WANG Hui;
..............page:135-137,186
Generation and Growth of Tin Whisker in Surface of Pin Frame of QFP During Heat Test
ZOU Jia-jia;,SUN Xiao-wei;,CHENG Ming-sheng;
..............page:138-140,159
Thermal Characteristics for Circuit Chips with Graphene Layer
BAN Tao;,PAN Zhong-liang;
..............page:141-143
Technology on CO2 Laser Cutting of LTCC Substrate
WANG Yun-long;,SONG Xia;,QIU Ying-xia;,WANG Zhi-qin;
..............page:144-148,181
Simulation of Size Effect on Solder Joint Thermal Cycle Reliability
FU Hui-peng;,WANG Kang;
..............page:149-152
Study on Dielectric Properties ofxCaTiO3-(1-x)LaAlO3 Microwave Dielectric Ceramic
WANG Xiao-guo;,SONG Yong-sheng;,MO Fang-ce;,ZHOU Yong-xiang;
..............page:153-156
Design and Performance of Mid-voltage High-capacitance Multi-layer Ceramic Capacitors
ZHUO Jin-li;,LU Heng;,AN Ke-rong;
..............page:157-159
Substitutability of Immerson-type PbS Detector
LIU Xi-xian;,SHU Xiao-hui;,ZOU Hong-jun;,FAN Cheng;,ZHANG Wei;
..............page:163-165
Manufacturing Technology of Structure and Function Integral Airship Antenna Refl ective Board
ZHOU Hai-feng;,JU Jin-shan;,XUE Wei-feng;,WEI Sheng-wen;,TONG Wen-qing;
..............page:166-167,174
Development of Test Method for Junction to Case Thermal Resistance of Semiconductor Devices
peng hao ;, ru zhi qin ;, zhang rui xia ;, liu dong yue ;, xu li sheng ;
..............page:171-174
Quality Improvement of Punching Unit for LTCC
YANG Wei;,WANG Hai-zhen;,SI Ying-jun;
..............page:175-177
Study on Formulation Technology of Two-component Sealant
LIU Kai;,SHEN Xiao-fei;
..............page:178-181
Management of Green Supply Chain in Electronic and Electrical Products (continued)
JIA Bian-fen;,LV Shu-zhen;
..............page:182-186