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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2016 Issue 2
Fluorescent Layer Failure XPS Analysis of Plate LED COB Lighting Source
ZANG Yan-li;,LIU Shuang-xi;,AN Bing;,WU Yi-ping;
..............page:63-66,98
Research Progress of High Voltage IGBT Surface Passivation Process
LI Li;,LIU Jiang;,WU Di;,WANG Yao-hua;,JIN Rui;
..............page:67-70,98
Application of BGA Interconnection in Wide-band RF Microsystem
XIANG Wei-wei;,ZHANG Ji-fan;,DONG Dong;,LU Qian;,WANG Hui;
..............page:71-73,93
Study on Microelectronic Integration Technique of AlSi
JI Xing-qiao;,LI Yue;,PENG Ting;
..............page:74-76,84
Design and Implementation of Ball Repair Equipment in WLP
LIU Jin-song;,CHU Da-wei;,WANG Sen;
..............page:77-80
Effect of Buffer Layers on Properties of Thin Films in Circuit Fabrication
CHEN Shuai;,QIU Ying-xia;,WEI Xiao-min;,GUO Yu-hua;,SONG Xia;
..............page:81-84
Application of Pouring Polyurethane Resin to Missile-borne
XU lei;
..............page:88-89,112
Study on LTCC Thick and Thin Film Hybrid Substrate Fabrication
DANG Yuan-lan;,ZHAO Fei;,TANG Xiao-ping;,LIANG Guang-hua;,LU Hui-xiang;,YAN Ying-zhan;,LIU Xiao-lan;
..............page:90-93
Effect of Electroplated Coating Quality on Gold-Aluminum Heterogeneous Wire Bonding Stability
GAO Wei-dong;,ZHANG Xian-shun;,LIN Hai-bo;
..............page:94-95,124
Failure Analysis of Connector Plastic Packaging Material
XU Huan-xiang;,CAI Ying-ying;
..............page:96-98
Common Packaging Defects and Control Methods in Metal Packaging VDMOS Devices
WANG Ning-ning;,FEI Jing-ming;,ZHANG Bin-bin;,HE Zong-peng;
..............page:99-102
Study on Delamination Mechanisation of Plastic Package Power Device
XU Xiao-ping;
..............page:103-105,120
Manufacturing Technology of Large-diameter Reflector Antenna
JIANG Hai-dong;,LIANG Wen-zhong;,LEI Dang-gang;,YANG Zhao-jun;
..............page:113-116
Research of Online Inspection on Punching Machine for Ceramic Green Sheet
YANG Wei;,ZHANG Zhi-yao;,WANG Hai-zhen;
..............page:117-120
Cleaning Technology for PCBA in Electronics Assembly(continued)
SHI Jian-wei;,SUN Lei;
..............page:121-124