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Electronics Process Technology
1001-3474
2015 Issue 5
Blackened Failure Analysis of Plate LED COB Lighting Source
LIU Shuang-xi;,YANG Zhuo-ran;,OU Yan-jie;,ZANG Yan-li;,WU Yi-ping;
..............page:249-252
Research Progress of Die Assembly Reliability and Quality Testing Method
CHEN Cai;,GONG Wei-yan;,QI Jun-feng;,CHEN Ya-rong;
..............page:253-256
2~6 GHz Correlator Based on LTCC/D Technology
XIAO Hui;,LIU Zhi-hui;
..............page:257-259,303
Reliabilty Analysis for Wire Bonding in Micro-system Packaging
DONG Jiang;,HU Rong;
..............page:260-264
Investigation on Packing Reliability of Isotropic Conductive Adhesive under Humid and Hot Environment
WAN Chao;,WANG Ling;,DU Bin;,WANG Peng-cheng;,LIU yang;
..............page:265-268
IC Lead-forming Process Based on Manix FP System
WANG Yu-Long;,LIU Jian;,ZHANG Yan-Peng;
..............page:269-272
Manufacturing Technology of Thin LTCC Tape
TANG Xiao-ping;,ZHU Zheng-qiang;,LU Hui-xiang;,LI Pan-feng;,YAN Ying-zhan;
..............page:273-274,294
Desolder Technology of Electronic Component Used in Military Electro-optical Equipment
ZHANG Wei-ping;,PANG Li-ming;,HUANG Peng;,LIU Xin;,JI Ting;,BAI Hang-kong;,REN Jin-peng;,ZHAO Yong;
..............page:275-277,290
Protection and Coating Technology of PCBA in Electronic Assembly Field
XIAN Fei;,LIU Jiang-tao;,YI Ya-jun;,HU Shao-yun;,YANG Wei;
..............page:278-280
Study of Soldering Technology of Military Short Lead Ceramic Pin Grid Array
ZHANG Yan-peng;,WANG Yu-long;,ZHANG Wei;
..............page:281-282,307
Development of Silver Palladium Electrode Paste for Potentiometer
ZHOU Bao-rong;,LU Dong-mei;,LU Ning;,XUE Han-ying;
..............page:283-286
Study of Mechanical Reinforcement Process for PM90S Series Capacitor
ZHANG Jun;,ZHANG Bin-bin;,HE Zong-peng;
..............page:287-290
Application of Multimode Polymer Waveguide in Optical-Electrical Printed Circuit Board
WU Jin-hua;,YAN Hui-Juan;,ZHU Long-xiu;,PENG Zeng;,SHI Rui-zhi;,HAN Chun-hua;
..............page:291-294
Assembly Process Research of S Wave Band TR Module
LI Xue;,WANG Ze-xi;,LI Yong-zhan;
..............page:295-298
Effect of Sputtering Parameters on Properties of Cr/Cu Thin Films in Circuit Fabrication
CHEN Shuai;,QIU Ying-xia;,WEI Xiao-min;,GUO Yu-hua;,SONG Xia;
..............page:299-303
Assembly Techniques of Micro-Rectangular High Voltage Cable
HUANG Su-bo;,LI Shu-ming;
..............page:304-307
Cleaning Technology for PCBA in Electronics Assembly(continue)
SHI Jian-wei;,SUN Lei;
..............page:308-310