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Electronics Process Technology
1001-3474
2015 Issue 2
Thermal Design of High Power Plate LED COB Lighting Source
HU Ming-yu;,WU Yi-ping;,YANG Zhuo-ran;
..............page:63-68
Thermal Shock Performance of Sn0.45Ag0.68Cu Lead-Free Solder Joints
MENG Guo-qi;,YANG Dong-hua;,WANG Huai-shan;,LUO Hu;,WANG Qing-meng;,LIU Lu-ting;,XU Jie;,GAN Gui-sheng;
..............page:69-72
Effect of Reflow Temperature on Collapse and Voids in Mixed BGA Solders
JIANG Qing-lei;,ZHANG Wei;,WANG Xu-yan;,YU Chun-yu;,LIU Gang;
..............page:73-75,121
Process Optimization of Multi-chip-assembly of Millimeter Wave Interconnection
REN Rong;,SONG Xia;,QIU Ying-xia;,XIE Qi-lin;
..............page:76-78
Failure Mechanism and Failure Analysis of ICs in Sip Module
LU Qian;,DONG Dong;
..............page:79-82
Processing of Single Row Plug-in Connectors’ Splice and Installation
YU Da;,LIU Jing-guo;,ZHOU Huai-de;,LONG Ke-hui;,WEN Da-hua;,WANG Yu-long;,SUN Shou-hong;
..............page:83-85
New Type Coating Choose for PCBA of Spaceing Model Products
ZHENG Yi;,YANG Yi-feng;,LI Hua;,TAN Guo-hua;
..............page:89-93
Thin Film Resistor Integrated on Duroid Organic Material
QIN Yue-li;,GAO Neng-wu;,XIE Fei;
..............page:94-96,101
Analysis of Factors Affecting Quality of LTCC Circuit Manufacturing Process
DANG Yuan-lan;,ZHAO Fei;,TANG Xiao-ping;,YAN Ying-zhan;,LU Hui-xiang;
..............page:97-101
Orthogonal Experimental Analysis of Solder Bridging of Connector In Wave Soldering
WANG Wei-ping;,HE Xin-qiang;,GUI Sheng-si;,PAN Xiang-hu;,WU Wei-hui;,ZHANG Yong;
..............page:102-104,124
Development of High-power and Precision NTC Thermistors for SMT
YANG Jun;
..............page:105-106,114
Study Gold-plating Technology of SiCp/Al Packaging Material
LU Hai-yang;,ZHOU Ming-zhi;
..............page:107-109
Study on Encapsulation Technology of Electronic Products Relay Installation
WANG Zhuo-ru;,ZHANG Yun;,CHEN Yu-bao;
..............page:110-114
Failure Analysis on Pin and Socket Connectors in Rigid Coaxial Line
SONG Wei-min;,ZHU Shao-feng;,YANG Jing-hui;
..............page:115-117
geng zheng
dian zi gong yi ji shu bian ji bu ;
..............page:117-117
Manufacturing Technology of Ground Radar Antenna Framework
JIANG Hai-dong;,LEI-Dang-gang;,YANG Jing-hui;,YANG Zhao-jun;
..............page:118-121
Manual Soldering Process Technology (continued)
SHI Jian-wei;,TAN Zheng-dong;,ZHOU Xuan;,SU Li-jun;,DU bin;
..............page:122-124