Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2014 Issue 1
Current Status of Nanolead-Free Solder Alloys
HAN Bei-bei;,LI Ming-yu;,MA Xin;,YANG Ming;
..............page:1-5,44
Simulation and Analysis of Temperature Field of Self-propagating Reaction Connection Based on Al/Ni Film
WANG Bai-hui;,WU Feng-shun;,XIA Wei-sheng;,Z HUWen-bo;
..............page:6-10
Research Progress of Thermal Model and Mechanism of Composite Materials in Electronics Industry
DAI Yu;,GUO Gao-hang;,LIU Xiao-jian;,WAN Chao;,WANG Kun;,WANG Ling;
..............page:11-14,36
Studies on Flux-free Soldering Technology
MIN Zhi-xian;
..............page:19-21,25
Cavity and Microfluidics Fabrication Technology on LTCC Substrate
LI Hai-yan;,LI You-cheng;,WANG Ying-lin;
..............page:22-25
Study of Reliability of Rigid-flexible printed board for Spacecraft Abstract
GUO Xiao-yu;,SHI Lei;
..............page:26-31,41
Study on Semi-aqueous Cleaning of PCB Assembly in Aerospace Electronic Products
WANG Ning-ning;,WU Qiong;,YANG Meng;,ZHANG Bin-bin;,ZHANG Zi-lan;
..............page:32-36
Study on QFP, FP, 3D Removing Process with Hot Air Rework Station
DONG Yun-song;,WANG Xiu-li;,YAN Gui-sheng;
..............page:37-41
Technology and Process of Hermetic Parallel Seam Soldering
LI Xiao-yan;,WANG Gui-ping;
..............page:42-44
Study of LTCC Dicing Process by Grinding Wheel
LIU Zhi-hui;,SHU Ping;,YUE Shuai-qi;
..............page:49-51
Analysis of Temperature Characteristics Of Hydrogen Gas Protection Brazing Furnace
HAN Dong-liang;,ZHAO Xue-feng;
..............page:52-55
Analysis and Resolution of A Receiver Electromagnetic Interference
JIA Chao-ying;,ZHAO Guo-dong;
..............page:56-58
Selection and Application of Component in Electronic Assembly (continued)
DU bin;,DU Jun-kuan;,SHI Jian-wei;,WANG Jian-min;
..............page:59-62