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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2013 Issue 5
Influence of Fixture Materials on Soldering Area Ratio for Microwave Power Circuits
ZUO Yan-chun;LIU Gang;ZHU Qing
..............page:276-278
High Quality Soldering of BGA Device with Rework Station
ZHANG Jun;ZHOU Hai-tao;ZHANG Bin-bin
..............page:270-272,275
Analysis of Solder Ball Based on DOE
ZHANG Yong;LI Yin
..............page:293-296
Study on Key Technology of Any-layer HDI PCB
CHEN Shi-jin;XU Huan;YANG Shi-wei;HAN Zhi-wei;DENG Hong-xi
..............page:279-283
Reaserch for Component De-golding of Electronic Product
ZHANG Wei;SHI Bao-song;SUN Hui;ZHANG Xue-li
..............page:273-275
Development of Properties and Reliability of Low-Ag Lead-free Solder Materials
WANG Qiang-xiang;HU Ya-ting;CAI Shen;AN Bing;WU Yi-ping
..............page:253-257,306
Study on Sn-Zn Solder Used in Cu-Al Soldering
Ni Guang-chun;Zhang Hao;Han Min
..............page:297-298,302
Technology Research on Micro Hole Back Drilling
LIU Xiao-hua;CHEN Zheng-qing;SU Xin-hong;HUA Yan-sheng
..............page:289-292
Technology Research on Micro Hole back drilling
WANG Yun-biao;YANG Hong-xing;CHEN Ya-nan;ZHAO Quan
..............page:303-306
Finite Element Analysis on Mechanical Characteristic for CQFP Devices
LV Qiang;LI Wen-hua;YOU Ming-yi;SUN Yong;XU Xue-lian
..............page:263-265
New Progress in CIGS Thin Film Solar Cells
LIU Xiao-jian;WANG Ling;WANG Hong-qin;WAN Chao
..............page:258-262,310
Warping Causes and Improvement of PCB During Soldering
ZHANG Jun-jie;HAN Qi-long
..............page:284-288