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Electronics Process Technology
1001-3474
2011 Issue 6
ipc zhong guo zhao pin xin xi
..............page:I0007-I0007
RFID Die Packaging by Ultrasonic Flip-chip Technology
zhang jia bo ; an bing ; sun ya nan ; jiang qing qing ; wu zuo ping
..............page:326-329
Assembling Technology of Non-Symmetric Sandwich Structure Radome
wei sheng wen ; ju jin shan ; ni jing wei
..............page:370-372
Automatic Testing and Sorting System of Power Film Capacitors
jin jian ding ; ren jian
..............page:357-359
Sn-based Solder Reaction and Microstructure in Electronic Packaging and Assembly
an rong ; liu wei ; hang chun jin ; tian yan hong ; wang chun qing ; an mao zhong
..............page:321-325,329
Effect of Aging Treatment on Interface Reaction of SAC 305 Solder Joint
wang hui fen ; hou chang jin ; wu jin chang
..............page:346-348,372
Reliable Assembly Process and Mechanical Reinforcement Process of CCGA
zhang wei ; sun shou hong ; sun hui
..............page:349-352
Review on Reliability of Micro-Solder Joints Subjected to Thermal Cycling
li cong ; chen ji bing ; an bing ; wu zuo ping
..............page:316-320,329
Effect of Seed Mounting on SiC Crystal Quality by PVT Method
mao kai li ; xu wei ; wang ying min ; tian mu ; wang li zhong
..............page:367-369
Simulating of Forming Process for Color Kinescope Glass Pane
ma you ming ; chen da rong ; ding yu qing
..............page:313-315
Quality Control of Electronic Special Equipment
he ying
..............page:364-366,369
Analysis of Reasons for MLCC Delamination During Manufacturing
liu xin ; li zuo zuo ; chen chang yun
..............page:335-337
Effect of Crucible Position in Inductive Coil on Thermal Distribution of Large Diameter SiC Single Crystal
wang ying min ; mao kai li ; xu wei ; hou xiao rui
..............page:360-363
Application of Lead-free Technique in Military Electronic Product
che fei ; yang yi feng ; xia xin yu ; fan na
..............page:338-341,345
Study of Modified Mechanism on Doping a Little Cobalt among Second Generation Lead-free Low-Ag SAC Solder Alloy
fan rong rong ; liu zhe ; qiu hua sheng ; yi teng xue ; sen gong zhang ; ru ze chun
..............page:330-334,356
Research on Parameters of Lead-free BGA Reflow with Sn-Pb Solder-paste
xu chi ; bao xiao yun
..............page:342-345