Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2011 Issue 5
A Dynamic Test Method of Solder Preform Wettability
liu jia ; chen wei min ; zhou long zao ; an bing ; wu zuo ping
..............page:251-254,261
Research on Assembly of Solid-State Amplifier I/O for Satelliters
chen yi gang ; zhang hua ; zhou ming ; wang yu ; su wei
..............page:280-284
Motion Control Design of Pick-and-place Machine Based on DSP
peng zhi cong ; yi si wei ; long xu ming
..............page:265-267
Assembly Technology of DC Motor Power Driver
yi wei ; mao shu qin
..............page:303-305
Recent Research of Electrically Conductive Adhesives and Application in LED Industry
wan chao ; wang hong qin ; wang ling ; yang zhou ; zhang guo jun
..............page:268-271
Technology and Equipment of Precise Cutting of Surface Mounted Film Capacitor
zhu yue hong ; wei hai bin ; xin wei
..............page:294-296
Sn-9Zn/Cu Solder Joints Shear Strength and Fracture Morphology Analysis
sun jing ; meng gong ge ; chen yong sheng
..............page:262-264,276
RFID Antenna Manufacturing Technology by Die-Cutting
jiang qing qing ; an bing ; zhang jia bo ; wu zuo ping
..............page:255-257,271
Technology of Gold-Plated Cupreous Shell Encapsulation
liu yuan zhi ; lu xiao
..............page:297-299,302
Experimental Study of De-deforce of Tensile of Lap Bonding Solder Joint with Lead-free and lead Materials
sun shou hong ; zhang yu juan ; yi wei
..............page:285-287,290
Analyse of DFM of Electric Cable Module Inside chassis
wu hong ; wang jie
..............page:291-293,305
Technology of MCM-C/D in Microwave Circuit Substrate
hu jun ; liu long hua
..............page:288-290
Material and Technology Characters of Lead-free PCB Finish
shi jian wei
..............page:306-312,I0001