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Electronics Process Technology
1001-3474
2011 Issue 4
New Cyanide-free Immersion Gold Process of PCB
DONG Zhen-hua;LI De-liang;GAO Lin-jun;DONG Ming-qi;HUANG Lan;TANG Jiao;XU Yu-xia
..............page:189-192,216
Development of Electronic Packaging and Micro-assembly
WANG Jun-feng
..............page:197-201
Soldering Failure Reasons of BGA "Head in Pillow"
HE Guang-hui;LUO Dao-jun
..............page:202-204
Design of X-Ray Testing System of SMT Solder Joint
PENG Xu;LONG Xu-ming;XIA Hao-yan;ZHU Xiang;LI Yun;WANG Lin;LI Xin
..............page:193-196,235
Application of High-pressure Water Spray in IC High-Speed Pre-treatment Process of Electroplating
ZHOU Xiao-jun;CAO Li-ning;HU Zi-qing;MENG Chao;TUO Pei-zhi;LI Xiao-yong
..............page:236-238,241
Design of Isothermal Superplastic Extrusion Die for Microwave Shells
ZHU Qi-zheng;YANG Jing-hui
..............page:239-241
SMT Production Line Manufacturing Process Control Rules
JIA Xiao-ping;REN Bo-cheng
..............page:210-211,226
Study on 3D Cabling Technology Application of Electronic Device
ZHOU San-san;LIU En-fu
..............page:227-228,232
Analysis On Electromagnetic Compatibility of Low Frequency Cable In Assembly
SONG Dong;MIAO Ke;DENG Hong
..............page:212-216
Discuss on PCBA Manual Soldering Temperature
CHENG Gang
..............page:222-226
Research on Parallel Kinematics and Micro-Drive Platform Based on 3-PRP in a Flat
SHI Jian-wei;ZHANG Cheng
..............page:245-249
Study on Gear Friction Set Assembly
YANG Xing-e
..............page:242-244,249
High Capacitance MLCC Key Manufacturing Techniques Research
CHEN Chang-yun;LI Xiao-yu;ZHU Zhong-yong
..............page:229-232
xin xi dong tai
..............page:后插4-后插5