Home | Survey | Payment| Talks & Presentations | Job Opportunities
Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2011 Issue 3
Application of Vacuum Sintering to Electronic Assembly
ZHANG Shi-wei
..............page:156-159
Study on Regression Analysis for BGA Void Control
Gui Sheng-si;Liu Jia
..............page:148-151
Development of High Speed and Precision Motion Platform
DONG Yong-qian;DI Xi-yuan;ZHANG Zhi-yao;TIAN Fang
..............page:173-176
Research of Hot Air Reflow Oven\'s Temperature Controlled System
SONG Yao-zong;SHI Jian-wei;RAO Shu-min
..............page:138-140,144
Thermal Matching Technique Design for Electronics Packaging
REN Rong;XIE Qi-lin;GAO Yongxin;QIU Ying-xia
..............page:141-144
Key Technology of Polarizing Slice Edge Precision Machining
LIU Yu-cheng;LANG Peng
..............page:163-167
xin xi dong tai
..............page:后插1-后插14
Lead-free Wave Soldering Quality Analyzing in Nitrogen
SHI Jian-wei;SONG Yao-zong
..............page:185-187
Effects of Glass Power in Screen Printed Silver Front Electrodes on Series Resistance of Silicon Solar Cells
CHEN Nin;ZHANG Li-ying;ZHANG Yao-zhong;WANG Yan-fang;WU Chun-jian;HUANG Jian-hua;ZHANG Ya-fei
..............page:125-128,172
Surface Mount Technology and Process Control of BGA
WANG Si-qun;WANG Liu
..............page:152-155,172
Factors of Influencing SMT BGA Soldering
WANG Yong-bin
..............page:129-132,180
Effect of Different Soldering Time on Solder Joint Quality
WANG Hui-fen;WU Jin-chang
..............page:136-137,159