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Electronics Process Technology
1001-3474
2010 Issue 5
xin xi dong tai
..............page:310,后插1-后插6
Water Cooling Design for High Power LED Multi-Chip Module
yang chuan chao ; wang chun qing ; hang chun jin
..............page:253-257,274
Study of Hermetic Package Process with Au/Sn Alloy
yao li hua ; wu li qun ; cai zuo ; xu bo ; hu jin ; zhang wei
..............page:267-270
Vision System for Wafer Inspection
tian na ; pang shi jun ; wei xiao chong
..............page:303-305
Selection of Adhesive and Coating Process in Electronic Assembly
shi jian wei ; xu yuan ; wang jian bin
..............page:306-309
Inner Conductor Reliable Connection in High Power Coaxial Transmission Line
song wei min ; liu bing long ; li ming rong
..............page:296-298,302
Assemble Technics of Column Through Hole Rotation Slip-ring
yi wei ; mao shu qin
..............page:293-295,309
Status and Tendency of Detergent for Electronic Process
liu zi lian ; wu song ping ; luo dao jun
..............page:258-260,266
Study on Defect of Lead-free soldering
song chang fa
..............page:278-280,302
Study on Chemical Mechanical Polishing of Silicon Wafer
liu yu ling
..............page:299-302
Selection of Automatic Cleaning Machine
wu hong
..............page:275-277
PCB Design in SMT Process
wang sheng li ; zuo wei hong
..............page:286-289,309
Reliability of RFID Inlay Flip-Chip Packaging by Anisotropic Conductive Adhesive
tao jun lei ; an bing ; cai xiong hui ; wu zuo ping
..............page:249-252,305
Study on Delamination of HDI Multilayer PCB in Lead-free Reflow Process
qiu hua sheng ; zeng fu lin ; fan rong rong
..............page:261-266
Reverse Technology from Lead-free Devices to Lead Devices
sun shou hong
..............page:271-274
DFM Technology Application In PCB Design
zhang wen zuo ; wang jun ; yang chun xia
..............page:281-285
Metal-coated Optical Fibers with High Temperature-resistance and Analysis of Thermal Stresses
gu qing chang ; cheng li you ; zhang wan cheng
..............page:290-292,309