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Electronics Process Technology
1001-3474
2009 Issue 6
Selection of Solder Paste in Electronic Assembly
xu yuan ; shi jian wei ; yang ji feng ; wang jian bin
..............page:319-322,326
Overview of Gray Tin Problem
mo li ping ; wu feng shun ; liu hui ; zhou long zao ; an bing ; wu zuo ping
..............page:315-318
Research on Tensile Deformation Behavior of Tiny Joint Containing Finite Number of Grains
huang teng fei ; yang shi hua ; niu li na ; tian yan hong ; wang chun qing
..............page:311-314,318
Technology of 3D Packaging and TSV
lang peng ; gao zhi fang ; niu yan hong
..............page:323-326
Precise Transmit of Thermal Energy is Key for Lead-free Manual Soldering
lang xiang hua
..............page:327-329,341
Research of Centrifugal Cleaning for PCB
yue jun ; niu jin yi
..............page:330-332,345
Precise Cleaning Technology of Radar T/R Module
lin wei cheng
..............page:333-337
Design of EADI Graphics Displaying System Based on DSP and FPGA
jing zhong yuan
..............page:363-366
Applications of Cable Bundle Protective Cover
lu jia ; huang ping
..............page:353-355,366
Electroless Plating Technology of High Precision Ceramic Substrate
wu xiao xia ; hu jiang hua
..............page:356-358
Temepature control of Piezo Ceramic Sintering
yu xiang yang ; ma xiao feng ; cui xiao gai
..............page:359-362
Rework of QFP Applied to Aerospace Products
wu jun
..............page:338-341
Research on Simulation of Reflow Soldering Process of SMT
shen zhen fang
..............page:342-345
SPC Quality Control for Gold Wire-bonding
li xiao xuan ; ding you shi ; yan wei
..............page:346-348
News
..............page:372
Workshop Management and Quality Control in SMT
shi jian wei ; xu zhi xiong ; li zhi wen ; yang ji feng
..............page:367-370