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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2009 Issue 5
Impacts of Void Defects on Thermal Fatigue Life in Coaxial-cable Solder Joint
LIU Qi;LI Wei;TIAN Yan-hong
..............page:249-252,257
Nanoimprint Technology and Applications
LUO Kang;DUAN Zhi-yong
..............page:253-257
Electric-contact Material Tin and Its Alloy Plating
YUAN Dong;ZHANG Bao-gen
..............page:274-278
Selection of Solder Paste in Electronic Assembly
XU Yuan;SHI Jian-wei;YANG Ji-feng;WANG Jian-bin
..............page:270-273
Technolgoy of SMC/SMD Manual Soldering
CHEN Zeng-sheng
..............page:279-281,286
Tin Whisker and Its Mitigation Technology
LIU Yan-xin;REN Bo-cheng
..............page:282-286
Development of LCD Polarizer Attaching Machine In China
JI Hui-yuan
..............page:261-263,266
xin xi chuang
..............page:310
New Solderability Electroplating Technology in Lead Frame
ZENG Xu;LU Gui-ping;YANG Jie;HE Yan-feng
..............page:291-294
Single Board Aging Technology of Relay Protector
GUO Xiao-fu
..............page:301-304,308
Choice of Flux in Electronic Assembly
SHI Jian-wei;XU Yuan;WANG Jian-bin;LIANG Quan
..............page:305-308
Research of High Performance insulation Pottig Materials
LI Nan;SU Gui-ming;WANG Yu-fei;LIU Hua-rong;JANG Wei-li
..............page:287-290
Multilayer Micro-strip Antenna Composite Molding
WEI Sheng-wen;WU Wen-yu;SUN Guo-qing
..............page:295-297
Research on Conductor Connecting Process
CAO Gao-xing
..............page:298-300