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Electronics Process Technology
1001-3474
2008 Issue 6
High Temperature Adhesive Used in Motor Magnet Laminated
MA Li;SU Gui-ming;JIANG Wei-li;LIU Hua-rong
..............page:355-357
EMC Application for the Certain Command Motorcar Cabin
GUO Li-zhen
..............page:358-360,364
Solder Defects and Solutions in Lead-free Soldering Technology
SHI Jian-wei
..............page:365-367,369
Intrinsic Frequency Modal Analysis of Amplitude Horn in Thermosonic Bonder
CHAO Yu-qing;YANG Zhao-jian;Qiao Hai-ling;DONG Yong-qian
..............page:352-354,357
Development of GZP-2 Automatic Coading Wafer Machine
YANG Jing;SONG Jian-cheng;SUN Xiao-bo;LI Jun-ling
..............page:348-351
X-ray Inspection Machine With High Resolution for BGA
CAO Jie;MA Shu-bo;ZHANG Guo-qi;ZHAO Bao-Sheng;SAI Xiao-feng;LI Wei
..............page:346-347,351
Research and Application of the New Mini-connector and Its Assembly
ZHAO Hui-ping
..............page:340-342,345
Study on MLCC Produce Process Technology Based on Water Binder
SONG Zi-feng
..............page:338-339,345
Research and Application of DFM Software
JIANG Ping
..............page:331-333
Contrast Performance Analysis Between Lead-free and Tin——lead Alloys
YANG Guang-yu;XU Xin;DONG Yi
..............page:328-330,333
Optimized Research on Assembly Quality of MLCC
ZHU Zheng-hu
..............page:319-323
Lead-free Soldering High Temperature Influences on Components Reliable Application
WANG Wen-li;YAN Yan-fu;Wu Bo
..............page:317-318,323
Research on Micro/nanopattern Fabrication based on Nanoimprint Lithography at Low Temperature
SUN Hong-wen;LIU Jing-quan;CHEN Di
..............page:314-316,337