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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electronics Process Technology
1001-3474
2008 Issue 5
Progress of Self-propagating Reactive Foils
LI Qing-qian;WU Feng-shun;ZOU Jian;LI Jun;DU Bin
..............page:249-253,265
Thermal Analysis of White LED Projector Lamp Assembling Structure
HAN Lei-lei;WANG Chun-qing;TIAN Yan-hong
..............page:254-255,261
Green Manufacturing of Electronics and Materials for Green Electronic Packaging
YANG Yan;YIN Li-meng;XIAN Jian-wei;MA Xin;ZHANG Xing-ping
..............page:256-261
Study on Crosstalk in High Speed Interconnect
ZHANG Shao-hua;ZHOU De-jian
..............page:262-265
Analysis of Screening Scheme for Chip Inductors
XIAO Qian;DING Xiao-hong;JIA Ying;YU Bin
..............page:266-268,290
Methods and Measures for Improving SMT Line Efficiency
XIAN Fei
..............page:269-271,290
Optimized Soldering Process Research on Semi-rigid Cable Modules
ZHU Zheng-hu;HAO Guan-jun
..............page:272-275
Flat Cable Assemby Process Design Technique and Application
XU Ying;ZHAO Xi-jun;WANG Yu
..............page:276-277,301
Thermal Design of IC Packaging
LIN Gang-qiang
..............page:278-281
Selection of AOI Equipment
WU Hong
..............page:282-285
Preparation of Small Size Particle Flake Silver Powder
WU Hai-bin;MENG Shu-yuan;TANG Yuan-xun
..............page:286-290
Composition and Control Technology of Polysilicon Ingot Furnace
HOU Wei-qiang
..............page:291-293
Summarization of Fault Diagnosis Techniques of Electronic Equipment
XU Ji-ren;LIU Jing-zhi;NIU Ji-hai;JIANG Cong-jun
..............page:294-298
Technology of Mirror Surface Milling on the Edge of Polarizer
SHI Guo-yi;YA Gang
..............page:299-301
Solder Defects and Solutions in Lead-free Soldering Technology
SHI Jian-wei
..............page:305-307,310
Foreign Literature Guide
..............page:308