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Electronics Process Technology
1001-3474
2004 Issue 1
xin nian he ci
..............page:插1
Promotion of SMT on Micro - electronic Packaging
kuang yan xiang ; zhu song chun
..............page:42-45
Signal Integrity of High - speed Design
lv zuo ; zhu liang
..............page:39-41
Severeal Points of Bending Techniques
liu yong sheng
..............page:33-36
A Miniaturized High Resolution LED Display Matrix Device
wang shi he ; zhang hao ran ; zhou dong lian
..............page:25-29
Effect of Enhanced Particles Cu on Creep Rupture Life of SnPb Based Composite Solder
zuo yan fu ; liu jian ping ; shi yao wu ; xia zhi dong ; zhou guo feng
..............page:20-22
Solder Volume on the Strength of Through- Hole Reflow Solder Joints
zhang wei ; wang chun qing ; sun fu jiang
..............page:17-19
Optimized Composition With Low- melting Point of Ternary Sn- Ag - Cu System
peng min ; wang ying min ; zhang xin fang ; qiang jian bing ; li de jun ; dong chuang
..............page:13-16
Making Flip Chip Assembly
hu zhi yong
..............page:9-12
Summarization of Lead- free Technology in Electronic Packaging
tian min bo ; ma peng fei
..............page:1-4,16