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Electroplating & Finishing
1004-227X
2015 Issue 16
Microstructure and properties of pulse-reverse electroformed gold coating from cyanide-free solution
LEI Ting;YUAN Xin-qiang;ZHENG Li-shan;Gemological Institute;China University of Geosciences;
..............page:893-897
Study on dispersity of nano-titania during electroless nickel–phosphorus nanocomposite plating
CHEN Er-yue;YANG Xiao-chao;XU Juan;GUO Xiang-feng;Qiqihar University;
..............page:898-902
Effects of different passivation methods on composition and performances of the passivation film on tinplate
WANG Ming-hao;LU Yong-liang;ZHAI Yun-fei;WANG Zhi-deng;WANG Zi-yu;LI Ning;School of Chemical Engineering & Technology;Harbin Institute of Technology;
..............page:903-908
Effect of diffusion annealing temperature on iron–aluminum intermetallic compound coating on steel substrate
TONG Heng;LI Wen-guang;WANG Feng;LIAO Yuan-lu;ZHOU Yin;ZHANG Qiu-yang;WANG Shu-qi;Henan Province Institute of Boiler and Pressure Vessel Safety Testing;
..............page:909-913
Effect of aluminum current collector with surface treatment on performance of lithium-ion battery
LI Jun-peng;DANG Hai-feng;YANG Wei;XUE Jian-jun;DONG Xin-fa;LIN Wei-ming;Department of Environmental Engineering;Guangdong Industry Technical College;
..............page:914-917
Preparation of high-porosity microporous iron foam
CAO Hua-zhen;HONG Kun-bao;WU Lian-kui;ZHENG Guo-qu;College of Materials Science and Engineering;Zhejiang University of Technology;
..............page:918-924
Study on corrosion problem of zinc coating after fine grinding
DENG Arain;PENG Tuo;ZHOU Tong-li;WANG Lin;LI Bin;Zhuzhou Times New Material Technology Co.;Ltd.;
..............page:925-927
Reason analysis on blistering in zinc coating prepared from cyanide-free alkaline zincate bath and corresponding solutions
ZHANG Xiao-yong;Henan Beifang Xingguang Electromechanical Co.;Ltd.;
..............page:928-930
shu xun
..............page:930+952
Application of membrane technique to treatment of wastewater discharged from printed circuit board production
LIAO Zhao-mei;Jiangmen Sanqing Environmental Technique Engineering Co.;Ltd.;
..............page:931-934
Treatment of organic wastewater from printed circuit board manufacturing
CAI Sheng-yun;DING Jian-hua;Environment Engineering Technology Center Ltd.;
..............page:935-939
Processes and formulations for multi-layered nickel electroplating
WANG Zong-xiong;PENG Hai-quan;WANG Chao;CHEN Zhuo;Ningbo Electroplating Industry Association;
..............page:940-952