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Electroplating & Finishing
1004-227X
2014 Issue 24
Electrodeposition of poly-8-hydroxyquinoline thin film by constant potential method
LIU Xiao-qin;,HUANG Feng-xiang;,ZENG Dong-ming;,HUANG Fa-jun;,LIU Zhong-xing;
..............page:1041-1044
Influence of citric acid on properties of anodized film on AZ31 magnesium alloy
XIONG Zhong-ping;,SI Yu-jun;,ZHENG Xing-wen;,LI Min-jiao;
..............page:1045-1048
Study on additive of copper plating for through hole of printed circuit board
MA Qian;,JIN Tao;,ZONG Tong-qiang;,ZENG Yu;,JI Hong-guo;,HAN Ya-dong;
..............page:1049-1052
Moderate-temperature failure analysis of nickel/silver coatings on the surface of electron tube
CHEN Hu;,YANG Wei-ying;,TANG Bing-hua;,PENG Jia-gen;
..............page:1053-1055
Study on high-temperature-resistant organic solderability preservative
KAN Li-li;,NIE Hao-yu;,WANG Xiu-yun;,ZHANG Guang-hao;,CHEN Hou-he;
..............page:1056-1059,后插1
Plating process for ceramic packaging micro-resistor
REN Ya-xun;,ZHANG Chun-lei;
..............page:1060-1063
Application of nickel electroplating process to production of electrical contact components
LIU Jian-ping;,LIU Yuan;,QIN Qing-sheng;
..............page:1064-1066,后插1
Qualitative determination and removal of nitrate impurity in acid nickel plating bath
WANG Zong-xiong;,CHU Rong-bang;,WANG Chao;
..............page:1067-1068
Current status of research on absorber layers of copper-based thin film solar cell prepared by electrodeposition
XU Yan;,LI Li-bo;,WANG Heng;,YANG Xiu-chun;,XIE Jing-chen;,WANG Wen-tao;
..............page:1073-1077
xin xi dong tai
..............page:1078-1081