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Journals   A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
Electroplating & Finishing
1004-227X
2014 Issue 21
Research on kinetics of tin electrodeposition in aqueous pyrophosphate electrolyte
FAN Xiao-ling;,GUO Yan;,XIE Jin-ping;,ZENG Zhen-ou;
..............page:907-910
Effects of different reductants for silver ink printing on preparation of printed circuit board by electroless copper plating on polyimide substrate
CHEN Huan-wen;,DENG Tian-liang;,GONG Xiao-zhong;,LIAO Li-jun;,LIU Xiao-nan;,WEN Lin-sen;,ZHU Xiao-yuan;
..............page:911-914
Process for plating double-layer chromium coating on TC2 titanium alloy
GAO Jing;,SHA Chun-peng;,ZHAO Li-cai;
..............page:919-921
Cyanide-free silver plating on aluminum alloy substrates
GE Xin;,HU Dong-wei;,LI Guang-yan;
..............page:922-924
Local thick-film hard anodizing process for aluminum alloys
SHU Wei-fa;,ZHANG Hai-jin;
..............page:925-928
xin xi dong tai
..............page:928,938,943-946,948
Development of environmentally friendly room temperature metal degreaser
LAI Li-chao;,TANG Chun-bao;,ZHANG Feng-ru;
..............page:929-931
Analysis on formation causes of copper particle defect on copper-plated printed circuit board
JIANG Jie-meng;,ZHAN Shi-jing;,ZHENG Fan;
..............page:932-934