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Electroplating & Finishing
1004-227X
2014 Issue 15
Effect of thiourea on electroless copper plating on polymethylmethacrylate substrate
LI Wei-ya;,LIU Yan;,WANG Wei;,YU Dan;
..............page:636-640,后插1
Electroless copper plating with palladium-free activation on the surface of polyimide film
HU Guang-hui;,LUO Jun-ming;,PAN Zhan-chang;,XIAO Chu-min;,ZENG Xiang-fu;,ZHANG Huang-chu;,ZHANG Peng-wei;
..............page:641-643
Study on antireflection films on sapphire glass for watch using vacuum evaporation
KONG Jing;,LIU Hai-hua;,SONG Peng-tao;,WU Chang;,XIE Yi;
..............page:648-650,后插1
Operation hints of acidic zinc-nickel alloy electroplating for iron castings
ZHANG Ju-Xiang;
..............page:659-662,后插1
Optimization of operation conditions of induced crystallization process used for treating heavy metal-containing electroplating wastewater
DONG Xiao-qing;,LI Ji;,NIU He-xin;,SHAO Pei-bing;,SU Hai;
..............page:663-667,后插1
Application and development prospect of cyanide-free alkaline copper electroplating
CHEN Wei-su;,SHANGGUAN Wen-long;,TIAN Zhi-bin;,WANG Kai;,ZHAN Yi-teng;
..............page:668-670
xin xi dong tai
..............page:672-675