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Electroplating & Finishing
1004-227X
2002 Issue 3
Study of solderable lead free tin-bismuth alloy electrodeposition
niu zhen jiang ; wu jie ; wu ting hua ; yao shi bing ; zhou shao min
..............page:1-5
Studies on electric contact silver based composite deposit intensified with nano crystal diamond particles
wu yuan kang ; yu ; xiong xiao hui ; yu hai liang
..............page:6-11
Effect of alloy elements on corrosion resistance of type 6063 aluminum alloys
liu wei qiang ; zhang jian xin
..............page:12-14,28
Study of new polyacrylamide flocculants
tan zheng de ; long you qian ; wang bi lian ; li xie cheng
..............page:15-19
Effect of rare earth element on electroless deposition of cobalt-nickel-boron alloy
zhang lei ; xuan tian peng ; huang qin hua
..............page:20-23
The effect of additives on electroless copper plating on ceramic surface
hu guang hui ; yang fang zu ; wu hui huang
..............page:24-28
Study of a new process for blocking of electroless nickel deposits
zhu li qun ; liu hui cong ; wu jun
..............page:29-33
Synthesis of water-based photosensitive resin
tao li ; huang gao shan ; nie hui ; huang liang
..............page:34-37,58
Coating process for outer parts of air conditioners
liu xian ming
..............page:38-41
Determination of fluoride ions in chromating bath of aluminum and its alloys
tan hua min ; liao chun ye
..............page:42-44
Pretreatment for PVC laminating on metal sheet
wei min xi
..............page:49-50
Factors affecting the ductility of bright barrel nickel deposits
chen huai chao ; han zhi zhong
..............page:53-55
Insulation of local electroplating pieces
zheng rui ting
..............page:59-61,44
zhong guo zhuan li xin xi
..............page:62-64